B1160C
| Model | B1160C |
| Description | solid state crowbar devices |
| PDF file | Total 212 pages (File size: 2M) |
| Chip Manufacturer | TECCOR |
TeleLink Fuse
Temperature Derating Curve
Operating temperature is -55 °C to +125 °C with proper correction factor applied.
150
140
130
120
Percent of Rating
110
100
90
80
70
60
50
40
30
-55 -60 -40
-20
0
20
40
60
80
100 125
Effect on
Current Rating
Ambient ˚C
Chart of Correction Factor
Maximum Temperature Rise
TeleLink Fuse
F0500T
F1250T
F1251T
* Higher currents and PCB layout designs can affect this parameter.
Notes:
• Readings are measured at rated current after temperature stabilizes
• The F1250T meets the requirements of UL 248-14. However, board layout, board trace widths, and ambient
temperature values can cause higher than expected rises in temperature. During UL testing, the typical
recorded heat rise for the F1250T at 2.2 A was 120 °C.
Temperature Reading
£75
°C (167 °F) *
£75
°C (167 °F) *
£75
°C (167 °F) *
Package Symbolization
Marking
FU
FT
JU
JT
NU
NT
F0500T
F
F
J
J
N
N
U
T
U
T
F1250T
F1251T
Manufactured in
USA
U
T
Manufactured in
Taiwan
© 2002 Teccor Electronics
SIDACtor
®
Data Book and Design Guide
2 - 69
http://www.teccor.com
+1 972-580-7777
Data Sheets
