K1S1616B5M-EE70T
| Model | K1S1616B5M-EE70T |
| Description | DRAM |
| PDF file | Total 12 pages (File size: 217K) |
| Chip Manufacturer | SAMSUNG |
Advance
K1S1616B5M
PACKAGE DIMENSION
48 TAPE BALL GRID ARRAY(0.75mm ball pitch)
Top View
Bottom View
B
B
6
A
#A1
B
C
D
C1
E
C1/2
F
G
H
B/2
Detail A
A
0.35/Typ.
Y
0.55/Typ.
Notes.
1. Bump counts: 48(8 row x 6 column)
-
2. Bump pitch : (x,y)=(0.75 x 0.75)(typ.)
3. All tolerence are
±0.050
unless
-
0.50
1.00
-
0.40
0.08
specified beside figures.
4. Typ : Typical
5. Y is coplanarity: 0.08(Max)
- 10 -
C
5
4
B1
UtRAM
Unit: millimeters
3
2
1
Side View
D
C
Min
A
B
B1
C
C1
D
E
E1
E2
Y
-
0.40
-
-
0.30
-
-
-
Typ
0.75
TBD
3.75
TBD
5.25
0.45
0.90
0.55
0.35
-
Max
-
Revision 0.0
May 2002
C
E2
E1
E
