K1S3216B9E-FI70T
| Model | K1S3216B9E-FI70T |
| Description | DRAM |
| PDF file | Total 17 pages (File size: 417K) |
| Chip Manufacturer | SAMSUNG |
K1S3216B9E
PACKAGE DIMENSION
48 BALL FINE PITCH BGA(0.75mm ball pitch)
Top View
Bottom View
B
B
6
A
#A1
B
C
D
5
4
B1
3
2
1
Preliminary
UtRAM
Unit: millimeters
C1
E
C1/2
F
G
H
B/2
Detail A
A
0.35/Typ.
Y
0.55/Typ.
Notes.
1. Bump counts: 48(8 row x 6 column)
2. Bump pitch : (x,y)=(0.75 x 0.75)(typ.)
3. All tolerence are
±0.050
unless
specified beside figures.
4. Typ : Typical
5. Y is coplanarity: 0.08(Max)
- 14 -
Side View
D
C
Min
A
B
B1
C
C1
D
E
E1
E2
Y
-
5.90
-
6.90
-
0.40
-
-
0.30
-
Typ
0.75
6.00
3.75
7.00
5.25
0.45
0.90
0.55
0.35
-
Max
-
6.10
-
7.10
-
0.50
1.00
-
0.40
0.08
C
Revision 0.0
December 2006
C
E2
E1
E
