• Inventory
  • Products
  • Technical Information
  • Circuit Diagram
  • Data Sheet
Data Sheet
Home > Data Sheet > K1B3216BDD-FI700
K1B3216BDD-FI700

K1B3216BDD-FI700

Model K1B3216BDD-FI700
Description Memory IC, 2MX16, CMOS, PBGA54
PDF file Total 42 pages (File size: 735K)
Chip Manufacturer SAMSUNG
K1B3216BDD
SYNCHRONOUS BURST READ TIMING WAVEFORM
Fig.24 TIMING WAVEFORM OF BURST READ CYCLE(1)
[Latency=5,Burst Length=4,WP=Low enable](WE=V
IH
)
- CS Toggling Consecutive Burst Read
0
T
CLK
t
ADVH
t
ADVS
ADV
t
AS(B)
Address
Valid
UtRAM
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
t
BEADV
t
AH(B)
Don’t Care
Valid
t
CSS(B)
CS
t
BC
t
CSHP
t
BEL
LB, UB
t
BLZ
t
OEL
OE
t
OLZ
Latency 5
Data out
t
WL
WAIT
High-Z
t
WH
t
CD
Undefined
t
OH
DQ0
DQ1
DQ2
DQ3
t
WZ
(SYNCHRONOUS BURST READ CYCLE - CS Toggling Consecutive Burst Read)
1. The new burst operation can be issued only after the previous burst operation is finished. For the new burst operation, tBEADV
should be met.
2. /WAIT Low(tWL or tAWL) : Data not available(driven by CS low going edge or ADV low going edge)
/WAIT High(tWH) : Data available(driven by Latency-1 clock)
/WAIT High-Z(tWZ) : Data don’t care(driven by CS high going edge)
3. Multiple clock risings are allowed during low ADV period. The burst operation starts from the first clock rising.
4. Burst Cycle Time(tBC) should not be over 2.5µs.
Table 28. BURST READ AC CHARACTERISTICS
(CS Toggling Consecutive Burst)
Symbol
Min
t
CSHP
t
BEL
t
OEL
t
BLZ
t
OLZ
t
HZ
t
CHZ
5
1
1
5
5
-
-
Speed
Max
-
-
-
-
-
12
12
ns
clock
clock
ns
ns
ns
ns
t
OHZ
t
BHZ
t
CD
t
OH
t
WL
t
WH
t
WZ
Units
Symbol
Min
-
-
-
3
-
-
-
Speed
Max
12
12
10
-
10
12
12
ns
ns
ns
ns
ns
ns
ns
Units
- 28 -
t
BHZ
t
OHZ
t
CHZ
t
HZ
t
WL
t
WH
Revision 1.0
April 2005
Go Upload

* Only PDF files are allowed for upload

* Enter up to 200 characters.