G1-266P-85-1.8
| Model | G1-266P-85-1.8 |
| Description | Processor Series Low Power Integrated x86 Solution |
| PDF file | Total 247 pages (File size: 4M) |
| Chip Manufacturer | NSC |
Geode™ GX1 Processor Series
Electrical Specifications
(Continued)
6.2
ELECTRICAL CONNECTIONS
6.2.1.1 Power Planes
power plane between V
CC2
(core: 1.6V, 1.8V, 2.0V) and
V
CC3
(I/O: 3.3V) volts in the BGA package. The illustration
assumes there is one power plane, and no components on
the back of the board.
power plane between V
CC2
(core: 1.6V, 1.8V, 2.0V) and
V
CC3
(I/O: 3.3V) volts in the SPGA package.
6.2.1 Power/Ground Connections and Decoupling
Testing and operating the GX1 processor requires the use
of standard high frequency techniques to reduce parasitic
effects. These effects can be minimized by filtering the DC
power leads with low-inductance decoupling capacitors,
using low-impedance wiring, and by connecting all V
CC2
and V
CC3
pins to the appropriate voltage levels.
3.3V Plane
(V
CC3
)
A
1
26
A
1.6V, 1.8V, or 2.0V Plane
(V
CC2
)
3.3V Plane
(V
CC3
)
Geode™ GX1
Processor
352 BGA - Top View
1.6V, 1.8V, or 2.0V Plane
(V
CC2
)
3.3V Plane
(V
CC3
)
AF
1
26
AF
Legend
= High frequency capacitor
= 220 µF, low ESR capacitor
= 3.3V connection
= 1.6V, 1.8V, or 2.0V connection
Note:
Where signals cross plane splits, it is recommended to include
AC decoupling between planes with 47 pF capacitors.
3.3V Plane
(V
CC3
)
Figure 6-1. BGA Recommended Split Power Plane and Decoupling
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Revision 1.0
