G1-233P-85-1.8
| Model | G1-233P-85-1.8 |
| Description | Processor Series Low Power Integrated x86 Solution |
| PDF file | Total 247 pages (File size: 4M) |
| Chip Manufacturer | NSC |
Geode™ GX1 Processor Series
Package Specifications
(Continued)
7.2
MECHANICAL PACKAGE OUTLINES
Dimensions for the BGA package are shown in Figure 7-2. Figure 7-3 shows the SPGA dimensions. Table 7-3 gives the leg-
end for the symbols used in both package outlines.
D
D1
.889
REF.
S1
Seating
Plane
Z
aaa Z
E1
D
B
1.5
1.5
A1
A2
A
D2
Millimeters
Sym
A
A1
A2
aaa
B
D
D1
D2
F
S1
E1
1.42
0.60
34.80
31.55
32.80
Min
1.35
0.40
0.47
Max
2.23
0.65
0.83
0.20
0.90
35.20
31.95
35.20
0.35
1.82
Inches
Min
0.053
0.016
0.019
0.024
1.370
1.242
1.291
0.056
Max
0.088
0.026
0.033
0.008
0.035
1.386
1.258
1.386
0.014
0.072
A01 Index Chamfer
1.5 mm on a side
45 Degree Angle
CU Heat
Spreader
F
1.27 BASIC
0.05 BASIC
Figure 7-2. 352-Terminal BGA Mechanical Package Outline
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Revision 1.0
