G1-233P-85-1.8
| Model | G1-233P-85-1.8 |
| Description | Processor Series Low Power Integrated x86 Solution |
| PDF file | Total 247 pages (File size: 4M) |
| Chip Manufacturer | NSC |
Geode™ GX1 Processor Series
Package Specifications
(Continued)
Table 7-3. Mechanical Package Outline Legend
Symbol
A
A1
A2
aaa
B
D
D1
D2
E1
E2
F
L
S1
Meaning
Distance from seating plane datum to highest point of body
Solder ball height
Laminate thickness (excluding heat spreader)
Coplanarity
Pin or solder ball diameter
Largest overall package outline dimension
Length from outer pin center to outer pin center
Heat spreader outline dimension
BGA: Solder ball pitch
SPGA: Linear spacing between true pin position centerlines
Linear spacing between true pin position centerlines for staggered pins
Flatness
Distance from seating plane to tip of pin
Length from outer pin/ball center to edge of laminate
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