G1-266B-85-1.8
| Model | G1-266B-85-1.8 |
| Description | Processor Series Low Power Integrated x86 Solution |
| PDF file | Total 247 pages (File size: 4M) |
| Chip Manufacturer | NSC |
Geode™ GX1 Processor Series
Package Specifications
(Continued)
D
D1
S1
1.65
1.40
REF.
SEATING
PLANE
L
E2
E1
D
B
Pin C3
2.16
2.29
1.52 REF.
45 CHAMFER
(INDEX CORNER)
o
A
D
Millimeters
Sym
A
B
D
D1
F
L
S1
E1
E2
Min
2.51
0.41
49.28
45.47
--
2.97
1.65
Max
3.07
0.51
49.91
45.97
0.127
Diag
3.38
2.16
Inches
Min
0.099
0.016
1.940
1.790
--
0.117
0.065
Max
0.121
0.020
1.965
1.810
0.005
Diag
0.133
0.085
A01 index mark
.030" blank circle
inside .060" filled
circle to form donut
F
2.54 BASIC
1.27 BASIC
0.100 BASIC
0.050 BASIC
Figure 7-3. 320-Pin SPGA Mechanical Package Outline
Revision 1.0
211
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