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Home > Data Sheet > G1-300P-85-2.0
G1-300P-85-2.0

G1-300P-85-2.0

Model G1-300P-85-2.0
Description Processor Series Low Power Integrated x86 Solution
PDF file Total 247 pages (File size: 4M)
Chip Manufacturer NSC
Geode™ GX1 Processor Series
Package Specifications
(Continued)
Example 1
Assume P (max) = 5W and T
A
(max) = 40°C.
Therefore:
TC
T A
θ
CA
= ---------------------
-
P
(
85 – 40
)
θ
CA
= ----------------------
5
θ
= 9
Example 2
Assume P (max) = 10W and T
A
(max) = 40°C.
Therefore:
TC
T A
θ
CA
= ---------------------
-
P
(
85 – 40
)
θ
CA
= ----------------------
9
θ
= 5
CA
CA
The heatsink must provide a thermal resistance below
9°C/W. In this case, the heatsink under consideration is
more than adequate since at 5W worst case, it can limit the
case temperature rise above ambient to 40°C (θ CA
= 8).
In this case, the heatsink under consideration is NOT ade-
quate to limit the case temperature rise above ambient to
45°C for a 9W processor.
For more information on thermal design considerations or
heatsink properties, refer to the Product Selection Guide of
any leading vendor of thermal engineering solutions.
Revision 1.0
209
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