G1-300P-85-2.0
| Model | G1-300P-85-2.0 |
| Description | Processor Series Low Power Integrated x86 Solution |
| PDF file | Total 247 pages (File size: 4M) |
| Chip Manufacturer | NSC |
Geode™ GX1 Processor Series
Signal Definitions
(Continued)
2.2.6
Internal Test and Measurement Signals (Continued)
BGA
Pin No.
F3
(PD)
SPGA
Pin No.
J5
(PD)
Type
I
Description
Test
Test-mode input.
This pin is internally connected to a weak (>20-kohm) pull-down
resistor.
TDP
E24
F36
O
Thermal Diode Positive
TDP is the positive terminal of the thermal diode on the die. The
diode is used to do thermal characterization of the device in a
system. This signal works in conjunction with TDN.
TDN
D26
E37
O
Thermal Diode Negative
TDN is the negative terminal of the thermal diode on the die.
The diode is used to do thermal characterization of the device in
a system. This signal works in conjunction with TDP.
Signal Name
TEST
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