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Home > Data Sheet > U1AFS600-1PQG208
U1AFS600-1PQG208

U1AFS600-1PQG208

Model U1AFS600-1PQG208
Description Field Programmable Gate Array,
PDF file Total 334 pages (File size: 18M)
Chip Manufacturer MICROSEMI
Device Architecture
User I/O Naming Convention
Due to the comprehensive and flexible nature of Fusion device user I/Os, a naming scheme is used to
show the details of the I/O (Figure
and
The name
identifies to which I/O bank it belongs, as well as the pairing and pin polarity for differential I/Os.
I/O Nomenclature
= Gmn/IOuxwByVz
Gmn is only used for I/Os that also have CCC access—i.e., global pins.
G
m
n
u
x
= Global
= Global pin location associated with each CCC on the device: A (northwest corner), B (northeast corner), C
(east middle), D (southeast corner), E (southwest corner), and F (west middle).
= Global input MUX and pin number of the associated Global location m, either A0, A1, A2, B0, B1, B2, C0, C1,
or C2.
shows the three input pins per clock source MUX at CCC location m.
= I/O pair number in the bank, starting at 00 from the northwest I/O bank and proceeding in a clockwise
direction.
= P (Positive) or N (Negative) for differential pairs, or R (Regular – single-ended) for the I/Os that support single-
ended and voltage-referenced I/O standards only. U (Positive-LVDS only) or V (Negative-LVDS only) restrict
the I/O differential pair from being selected as an LVPECL pair.
= D (Differential Pair), P (Pair), or S (Single-Ended). D (Differential Pair) if both members of the pair are bonded
out to adjacent pins or are separated only by one GND or NC pin; P (Pair) if both members of the pair are
bonded out but do not meet the adjacency requirement; or S (Single-Ended) if the I/O pair is not bonded out.
For Differential (D) pairs, adjacency for ball grid packages means only vertical or horizontal. Diagonal
adjacency does not meet the requirements for a true differential pair.
= Bank
= Bank number (0–3). The Bank number starts at 0 from the northwest I/O bank and proceeds in a clockwise
direction.
= Reference voltage
= Minibank number
w
B
y
V
z
Standard I/O Bank
CCC
"A"
Bank 0
CCC
"B"
Advanced I/O Bank
Bank 3
Bank 1
Advanced I/O Bank
CCC/PLL
"F"
AFS090
AFS250
CCC
"C"
Bank 3
Bank 1
CCC
"E"
Bank 2 (analog)
CCC
"D"
Analog Quads
Figure 2-111 •
Naming Conventions of Fusion Devices with Three Digital I/O Banks
2- 16 0
R e visio n 2
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