T1022NXE7MQA
| Model | T1022NXE7MQA |
| Description | 32-BIT, 1200MHz, RISC PROCESSOR, PBGA780 |
| PDF file | Total 197 pages (File size: 1M) |
| Chip Manufacturer | PHILIPS |
Hardware design considerations
4.8 Temperature diode
The chip has a temperature diode on the microprocessor that can be used in conjunction
with other system temperature monitoring devices (such as Analog Devices,
ADT7461A). These devices feature series resistance cancellation using 3 current
measurements, where up to 1.5kΩ of resistance can be automatically cancelled from the
temperature result, allowing noise filtering and a more accurate reading.
The following are the specifications of the chip's on-board temperature diode:
Operating range: 10 - 230μA
Ideality factor over 13.5 - 220 μA; Temperature range 80°C - 105°C: n = 1.004 ± 0.008
4.9 Thermal management information
This section provides thermal management information for the flip-chip, plastic-ball, grid
array (FC-PBGA) package for air-cooled applications. Proper thermal control design is
primarily dependent on the system-level design-the heat sink, airflow, and thermal
interface material.
The recommended attachment method to the heat sink is illustrated in
The heat
sink should be attached to the printed-circuit board with the spring force centered over
the die. This spring force should not exceed 15 pounds force (65 Newton).
Heat sink
Heat sink clip
FC-PBGA package (no lid)
Adhesive or
thermal interface material
Die
Printed circuit-board
Figure 87. Package exploded, cross-sectional view-FC-PBGA (no lid)
QorIQ T1042, T1022 Data Sheet, Rev. 2, 06/2015
Freescale Semiconductor, Inc.
189
