U1AFS250-2FG256YI
| Model | U1AFS250-2FG256YI |
| Description | Field Programmable Gate Array, |
| PDF file | Total 334 pages (File size: 18M) |
| Chip Manufacturer | MICROSEMI |
Device Architecture
Hot-Swap Support
Hot-swapping (also called hot plugging) is the operation of hot insertion or hot removal of a card in (or
from) a powered-up system. The levels of hot-swap support and examples of related applications are
described in
The I/Os also need to be configured in hot insertion mode if hot plugging
compliance is required.
Table 2-74 •
Levels of Hot-Swap Support
Hot
Power
Swapping
Applied
Level
Description to Device Bus State
1
Cold-swap
No
–
Device
Example of
Card
Circuitry
Application with
Ground
Connected Cards that Contain Compliance of
Connection to Bus Pins Fusion Devices
Fusion Devices
–
–
System and card with
Microsemi FPGA chip
are powered down,
then card gets
plugged into system,
then power supplies
are turned on for
system but not for
FPGA on card.
In PCI hot plug
specification, reset
control circuitry
isolates the card
busses until the card
supplies are at their
nominal operating
levels and stable.
Board bus shared
with card bus is
"frozen," and there is
no toggling activity on
bus. It is critical that
the logic states set on
the bus signal do not
get disturbed during
card
insertion/removal.
There is activity on
the system bus, and it
is critical that the logic
states set on the bus
signal do not get
disturbed during card
insertion/removal.
Compliant I/Os
can but do not
have to be set to
hot insertion
mode.
2
Hot-swap
while reset
Yes
Held in
Must be made –
reset state and
maintained for
1 ms before,
during, and
after insertion/
removal
Held idle
Same as
(no ongoing Level 2
I/O
processes
during
insertion/re
moval)
Must remain
glitch-free
during
power-up or
power-down
Compliant I/Os
can but do not
have to be set to
hot insertion
mode.
3
Hot-swap
while bus
idle
Yes
Compliant with
cards with two
levels of staging.
I/Os have to be
set to hot
insertion mode.
4
Hot-swap on
an active
bus
Yes
Bus may
Same as
have active Level 2
I/O
processes
ongoing,
but device
being
inserted or
removed
must be
idle.
Same as
Level 3
Compliant with
cards with two
levels of staging.
I/Os have to be
set to hot
insertion mode.
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