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U1AFS250-2FGG256YI

U1AFS250-2FGG256YI

Model U1AFS250-2FGG256YI
Description FPGA
PDF file Total 334 pages (File size: 18M)
Chip Manufacturer MICROSEMI
Fusion Family of Mixed Signal FPGAs
SSTL2 Class II
Stub-Speed Terminated Logic for 2.5 V memory bus standard (JESD8-9). Fusion devices support Class
II. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-159 •
Minimum and Maximum DC Input and Output Levels
SSTL2 Class II
Drive Strength
18 mA
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
VIL
Min.
V
–0.3
Max.
V
VIH
Min.
V
Max.
V
3.6
VOL
Max.
V
0.35
VOH
Min.
V
IOL IOH IOSL IOSH IIL
1
IIH
2
Max.
mA mA mA
3
18
124
Max.
mA
3
169
µA
4
µA
4
10
10
VREF – 0.2 VREF + 0.2
VCCI – 0.43 18
SSTL2
Class II
Test Point
25
VTT
25
30 pF
Figure 2-131 •
AC Loading
Table 2-160 •
AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.2
Input High (V)
VREF + 0.2
Measuring Point* (V)
1.25
VREF (typ.) (V)
1.25
VTT (typ.) (V)
1.25
C
LOAD
(pF)
30
Note:
*Measuring point = Vtrip. See
for a complete table of trip points.
Timing Characteristics
Table 2-161 •
SSTL 2 Class II
Commercial Temperature Range Conditions: T
J
= 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V, VREF = 1.25 V
Speed
Grade
Std.
–1
–2
t
DOUT
0.66
0.56
0.49
t
DP
2.17
1.84
1.62
t
DIN
0.04
0.04
0.03
t
PY
1.33
1.14
1.00
t
EOUT
0.43
0.36
0.32
t
ZL
2.21
1.88
1.65
t
ZH
1.77
1.51
1.32
t
LZ
t
HZ
t
ZLS
4.44
3.78
3.32
t
ZHS
4.01
3.41
2.99
Units
ns
ns
ns
Note:
For the derating values at specific junction temperature and voltage supply levels, refer to
Revision 3
2- 209
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