U1AFS250-2FGG256YI
| Model | U1AFS250-2FGG256YI |
| Description | FPGA |
| PDF file | Total 334 pages (File size: 18M) |
| Chip Manufacturer | MICROSEMI |
Fusion Family of Mixed Signal FPGAs
Product Ordering Codes
M1AFS600
_
1
FG
G
256
Y
I
Application (junction temperature range)
Blank = Commercial (0 to +85°C)
I = Industrial (–40 to +100°C)
PP = Pre-Production
ES = Engineering Silicon (room temperature only)
Security Feature
Y = Device Includes License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio
Package Lead Count
Lead-Free Packaging Options
Blank = Standard Packaging
G = RoHS-Compliant (green) Packaging
Package Type
QN = Quad Flat No Lead (0.5 mm pitch)
1
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
2
Speed Grade
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
Part Number
Fusion Devices
AFS090 =
AFS250 =
AFS600 =
AFS1500 =
90,000 System Gates
250,000 System Gates
600,000 System Gates
1,500,000 System Gates
ARM-Enabled Fusion Devices
M1AFS250 = 250,000 System Gates
M1AFS600 = 600,000 System Gates
M1AFS1500 = 1,500,000 System Gates
Pigeon Point Devices
P1AFS600 = 600,000 System Gates
P1AFS1500 = 1,500,000 System Gates
MicroBlade Devices
U1AFS250 = 250,000 System Gates
U1AFS600 = 600,000 System Gates
U1AFS1500 = 1,500,000 System Gates
Notes:
1. For Fusion devices, Quad Flat No Lead packages are only offered as RoHS compliant, QNG packages.
2. MicroBlade and Pigeon Point devices only support FG packages.
Fusion Device Status
Fusion
AFS090
AFS250
AFS600
AFS1500
Status
Production
Production
Production
Production
M1AFS250
M1AFS600
M1AFS1500
Production
Production
Production
P1AFS600
P1AFS1500
Production
Production
U1AFS250
U1AFS600
U1AFS1500
Production
Production
Production
Cortex-M1
Status
Pigeon Point
Status
MicroBlade
Status
R e visi on 3
III
