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U1AFS600-2FG256YI

U1AFS600-2FG256YI

Model U1AFS600-2FG256YI
Description Field Programmable Gate Array,
PDF file Total 334 pages (File size: 18M)
Chip Manufacturer MICROSEMI
DC and Power Characteristics
Dynamic Power Consumption of Various Internal Resources
Table 3-14 •
Different Components Contributing to the Dynamic Power Consumption in Fusion Devices
Power Supply
Parameter
PAC1
PAC2
PAC3
PAC4
PAC5
PAC6
Definition
Clock contribution of a Global
Rib
Clock contribution of a Global
Spine
Clock contribution of a VersaTile
row
Clock contribution of a VersaTile
used as a sequential module
First contribution of a VersaTile
used as a sequential module
Second
contribution
of
a
VersaTile used as a sequential
module
Contribution of a VersaTile used
as a combinatorial module
Average contribution of a routing
net
Contribution of an I/O input pin
(standard dependent)
Contribution of an I/O output pin
(standard dependent)
Average contribution of a RAM
block during a read operation
Average contribution of a RAM
block during a write operation
Dynamic Contribution for PLL
Contribution of NVM block during
a read operation (F < 33MHz)
1st contribution of NVM block
during a read operation (F > 33
MHz)
2nd contribution of NVM block
during a read operation (F > 33
MHz)
Crystal Oscillator contribution
RC Oscillator contribution
Analog Block dynamic power
contribution of ADC
Name
VCC
VCC
VCC
VCC
VCC
VCC
1.5 V
1.5 V
1.5 V
1.5 V
1.5 V
1.5 V
14.5
2.5
Device-Specific
Dynamic Contributions
AFS600
12.8
1.9
0.81
0.11
0.07
0.29
AFS250 AFS090
11
1.6
11
0.8
Units
µW/MHz
µW/MHz
µW/MHz
µW/MHz
µW/MHz
µW/MHz
Setting AFS1500
PAC7
PAC8
PAC9
PAC10
PAC11
PAC12
PAC13
PAC15
PAC16
VCC
VCC
VCCI
VCCI
VCC
VCC
VCC
VCC
VCC
1.5 V
1.5 V
0.29
0.70
See
See
µW/MHz
µW/MHz
1.5 V
1.5 V
1.5 V
1.5 V
1.5 V
25
30
2.6
358
12.88
µW/MHz
µW/MHz
µW/MHz
µW/MHz
mW
PAC17
VCC
1.5 V
4.8
µW/MHz
PAC18
PAC19
PAC20
VCC33A
VCC33A
VCC
3.3 V
3.3 V
1.5 V
0.63
3.3
3
mW
mW
mW
3- 22
R e visio n 3
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